AN3846 - Wafer Level Chip Scale Package (WLCSP) - Application Note

更新时间 2016-10-12

This application note provides guidelines for the handling and assembly of Freescale WLCSP (Wafer Level Chip Scale Package) during printed circuit board (PCB) assembly.

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英文文档 AN3846 - Wafer Level Chip Scale Package (WLCSP) - Application Note pdf REV 4.0 1.76MB 412