更新时间 2016-10-12
This application note provides guidelines for the handling and assembly of Freescale WLCSP (Wafer Level Chip Scale Package) during printed circuit board (PCB) assembly.
| 类型 | 文档标题 | 格式 | 版本 | 文件大小 | 下载次数 |
|---|---|---|---|---|---|
| 英文文档 | AN3846 - Wafer Level Chip Scale Package (WLCSP) - Application Note | REV 4.0 | 1.76MB | 488 |
